Key Skills

Job Description

Office location: Eindhoven, the Netherlands Project Foundation launched by The Fourth Law and Odd Systems is a semiconductor initiative to mass-produce thermal imaging sensors for Ukraine, the rest of Europe and the United States. The initiative covers the development of LWIR sensors and the deployment of a network of partner-operated and in-house manufacturing facilities. It will create a new industrial base for defense and civilian needs and supply affordable sensors to manufacturers of drones, vehicles, and robotics. The first sensors under the initiative are expected as early as 2027. The Fourth Law is a leading Ukrainian manufacturer of autonomy technologies for drones. Our solutions are codified according to NATO standards and are currently utilized by over 50 units of the Security and Defense Forces of Ukraine, as well as 20+ drone manufacturers. Odd Systems is a defense technology company specializing in the development and manufacturing of thermal imaging cameras. It was founded by a group of entrepreneurs, engineers, managers, and tech enthusiasts with prior experience at a number of international technology companies. Purpose of the Role: The MEMS / Semiconductor Processing Specialist develops and owns the step-by-step cleanroom process flow that takes the microbolometer from deposited films to a released, suspended structure. This is a hands-on process engineering role covering photolithography, thin-film deposition, and sacrificial layer etching — both isotropic and anisotropic — with direct responsibility for releasing delicate suspended structures without damage or collapse. The role works in the Eindhoven R&D lab alongside the IC/MEMS Integration and Simulation Engineer and the wider technical cohort, and reports to the CTO. Key Responsibilities: • Develop and document the end-to-end cleanroom process flow for microbolometer fabrication, from film deposition through structure release. • Own photolithography process steps: mask design coordination, exposure and develop parameters, and critical-dimension control. • Own thin-film deposition steps for sacrificial and structural layers, optimizing for uniformity, stress and compatibility with downstream process steps. • Develop and tune sacrificial-layer etch processes, both isotropic and anisotropic, to reliably release suspended microbolometer structures without stiction or membrane damage. • Troubleshoot yield and process excursions, working from wafer inspection and test data back to root cause. • Support equipment procurement, installation and commissioning in the new R&D lab, in coordination with the Technical Programme Manager. Experience and skills we are looking for: • A degree in materials science, microelectronics, physics, or a related field, with hands-on cleanroom process experience. • Direct experience with photolithography, thin-film deposition (e.g. PECVD, sputtering) and wet/dry etching in a MEMS or semiconductor cleanroom. • Working knowledge of sacrificial-layer release processes and common MEMS failure modes, including stiction and stress-induced curling. • Comfortable developing new process flow from first principles, not just running an established recipe. • Fluent English, with the communication maturity to work with an international, partly Ukrainian team. It’s a plus if you have: • Prior work specifically on microbolometers, uncooled IR detectors, or other suspended-membrane MEMS devices. • Experience commissioning cleanroom process equipment as part of a new lab or fab standup. • Familiarity with ISO Class 7 or better cleanroom operating discipline. • Based in, or willing to relocate to, Eindhoven for the Odd Factory One R&D lab. We are not just looking for employees, but for like-minded individuals who share our values and are ready to build the future of Ukrainian MilTech.

Core Responsibilities

Develop and document the cleanroom process flow for microbolometer fabrication, including photolithography, thin-film deposition, and isotropic and anisotropic sacrificial-layer etching to release suspended structures without damage. Troubleshoot yield and process issues using wafer inspection and test data, and support procurement, installation, and commissioning of equipment for the new R&D lab.

Requirements

Requires a degree in materials science, microelectronics, physics, or a related field, plus hands-on cleanroom experience with photolithography, thin-film deposition, and wet or dry etching. Candidates should understand sacrificial-layer release and MEMS failure modes, be able to develop processes from first principles, and communicate fluently in English; microbolometer experience and cleanroom commissioning are advantageous.