Key Skills

Job Description

The Package Design Engineer will be part of a geographically dispersed team of package design engineers responsible for the design of some of NXP’s most advanced packages including substrate-based Flip and Wire-Bond BGAs, WLCSP, FOWLP, modules / SiP’s, LiP / AiP, etc… This individual will lead package layout design efforts from the initial product definition phase through the package / die co-design to completed design leading to successful first silicon package functionality, qualification and production. They will work closely with the product engineering, IC design, package electrical simulation, substrate suppliers, assembly partners and various other teams to ensure the designs are completed on time and meet all performance, cost and where applicable reliability requirements. This candidate will participate in developing and maintaining the overall EDA tool strategy and design flow methodologies for package design within NXP. Key Skills: o Extensive experience and knowledge in semiconductor package design with a specific focus on leading edge substrate-based packages such as Wire-Bond and Flip Chip PBGA. o Expert at package design tools such as Cadence APD SIP, Allegro and/or AutoCAD. o Experience with die to package co-design flows and knowledge of tools such as Virtuoso, Innovus and ICC2. o Familiarity with various package substrate technologies and materials including HDI/build-up, coreless and conventional mechanically drilled. o Be able to effectively operate beyond organizational boundaries. o Ability to independently deliver results within the diverse technical global team within NXP as well as substrate, assembly and EDA suppliers. o Possess interpersonal skills to effectively resolve conflicts both within the organization with external organizations. o The candidate must be able to define and implement changes and improvements in design flow and tools where required. o Working knowledge of die, package and/or PCB-level electrical simulation and parasitic extraction tools such as HFSS, Apache, Clarity, Sigrity, and Momentum is a plus.

Core Responsibilities

Lead package layout design from product definition and package/die co-design through completed design, qualification, and production. Coordinate with engineering teams, suppliers, and assembly partners to meet performance, cost, schedule, and reliability requirements, and help develop package design tools and workflows.

Requirements

The role calls for extensive semiconductor package design experience, particularly with advanced substrate-based wire-bond and flip-chip BGA packages, and expertise in package design tools. Candidates should understand substrate technologies, work effectively across global and external teams, and be able to improve design flows; experience with electrical simulation and parasitic extraction tools is a plus.