Packaging Application Engineer
Key Skills
Job Description
Are you passionate about shaping the future of sustainable packaging and working directly with industry leaders to bring breakthrough technologies from concept to commercial reality? Join Kalpana Systems and help transform the packaging industry through next-generation coating solutions. About Kalpana Systems Kalpana Systems is a pioneer in roll-to-roll Spatial Atomic Layer Deposition (Spatial ALD) technology, enabling high-performance thin film coatings at industrial scale. Our technology addresses key challenges in sustainable packaging, energy storage and photovoltaics by delivering ultra-thin functional coatings with unmatched performance and scalability. As we expand our commercial activities in the packaging industry, we are seeking an experienced Packaging Application Engineer to join our commercial team and help accelerate the adoption of Spatial ALD solutions within the packaging market. Your Role as Packaging Application Engineer As Packaging Application Engineer, you will serve as the technical packaging specialist within the commercial team. You will play a critical role in connecting customer needs with Kalpana's technology capabilities. The role combines deep knowledge of packaging materials, applications, and manufacturing processes with strong commercial and customer engagement skills. You will work closely with packaging manufacturers, brand owners, converters, material suppliers, and development partners to understand their challenges and requirements. By translating customer needs into clear technical specifications, you will help guide internal development activities while supporting customers in evaluating and implementing ALD-based solutions. Tasks and Responsibilities · Act as the technical packaging expert within customer-facing commercial activities. · Engage with customers to understand packaging applications, performance requirements, regulatory constraints, and manufacturing needs. · Translate customer requirements into technical specifications for process development and equipment implementation. · Work closely with process engineers and mechanical design engineers to ensure customer requirements are accurately reflected in development activities. · Identify emerging trends, customer needs, and market opportunities within sustainable and high-performance packaging. · Support pilot projects, customer trials, and technology demonstrations. · Support the development of customer-specific business cases and value propositions for high barrier flexible packaging solutions with ALD. · Represent Kalpana Systems at customer meetings, conferences, trade shows, and industry events. · Contribute to strategic market development and roadmap activities for packaging application What We Are Looking For · Bachelor's, Master's, or equivalent degree in Packaging Technology, Materials Science, Chemical Engineering, Polymer Engineering, or a related field. · Experience working in the packaging industry, preferably in flexible packaging, barrier materials, packaging materials development, converting, coatings, or packaging innovation. · Strong understanding of packaging materials, barrier technologies, converting processes, packaging performance requirements, and packaging value chains. · Proven experience working with customers and translating market needs into technical development requirements. · Strong technical communication and stakeholder management skills. · Commercially minded with the ability to engage both technical and business decision-makers. · Fluency in English What We Are Offering You A dynamic and international working environment A unique opportunity to shape the future of packaging through breakthrough coating technology. A responsible role with autonomy and real impact on our commercial direction. Competitive salary. 25 days of paid holiday. Ready to help us power the future of sustainable tech? Send your CV and motivation letter to [email protected]. We’re looking forward to meeting you!
Core Responsibilities
Serve as the technical packaging specialist in customer-facing commercial activities, translating customer applications, performance needs, regulatory constraints, and manufacturing requirements into technical specifications. Support customer trials and demonstrations, develop value propositions for ALD-based high-barrier flexible packaging, and contribute to market development and product roadmaps.
Requirements
A bachelor's, master's, or equivalent degree in packaging technology, materials science, chemical engineering, polymer engineering, or a related field is requested, along with packaging-industry experience. Candidates should understand packaging materials, barrier technologies, converting, performance requirements, and value chains, and have experience translating customer needs into technical development requirements with strong communication and stakeholder-management skills.
Benefits
- 25 Days Of Paid Holiday
- Competitive Salary
About Kalpana Systems
Industry: Nanotechnology Research
Company size: 11-50 employees
What if you could accelerate the energy transition thanks to a new perspective on atomic layer deposition for thin films? Imagine batteries with next-level performance, unrivalled range and fast charging. Imagine affordable flexible solar panels and OLED screens for unrestricted designs. Imagine fully recyclable packaging, thanks to ultra-thin barrier coatings. We found a way to solve the challenges of applying ALD technology to thin films. We like to call it: Superspatial ALD. Inspired by the helical design found in nature, our technology provides an elegant solution to break from industry standards. Superspatial ALD enables the deposition of complex multi-layers in just one production step. The unique helical web transport in our thin film machine enables the roll-to-roll production of coating layers at high throughput. Superspatial ALD speeds up the ALD process by 1000 times, reducing cost by a factor of 10, using precious materials with the precision of a single atom. All with one machine, adaptable to fit different substrate types and widths, with a small footprint that seamlessly integrates into your production line. The wait is over. Superspatial ALD is finally here.