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Signal and Power Integrity Engineer

SPD Technology

Contractor
5-10 years experience
Remote OK

Key Skills

Signal Integrity
Power Integrity
High-Performance Computing
2.5D/3D Packaging
Power Distribution Networks
High-Speed Interface IP
Memory Interfaces
Post-Silicon Validation
Design for Manufacturability
HFSS
ADS
Sigrity
Siwave
Python
MATLAB
C++

Job Description

About us

At SPD Technology, we bring together a team of like-minded people who are driven by the desire to bring value through their work, united in their commitment to high performance and delivering custom, cutting-edge tech solutions that drive clients' growth. We empower our people with a culture of excellence, and enable them with the opportunity to uphold their accountability to contribute on each level. We value humanity and collaboration, encourage professional and personal growth, and foster a supportive and flexible work environment where everyone's contribution is welcomed.

We are looking for a Signal Integrity/Power Integrity Engineer to join us as part of our team.

About the role

As a Signal Integrity/Power Integrity Engineer you will work to shape the future of AI/ML hardware acceleration by driving cutting-edge TPU (Tensor Processing Unit) technology that powers the most demanding AI/ML applications. You will be part of a team developing custom silicon solutions, leveraging your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems. You will lead chip and package design, ensuring optimal SI/PI performance and system co-design from concept to production, while collaborating within a cross-functional team of Chip Design, IP, System Design, software, and vendors.

As a qualified expert You will
  • Lead signal integrity (SI) and power integrity (PI) analysis and optimization for High-Performance Computing (HPC) leveraging advanced 2.5D/3D packaging technologies.
  • Partner early in product definition to influence chip floorplanning, power distribution networks (PDN/power trees), netlists, and routability tradeoffs.
  • Evaluate high-speed interface IPs and develop next-generation memory interfaces across IO PHY, SI/PI, and physical design boundaries.
  • Drive post-silicon validation and qualification for NPI, balancing SI/PI performance and DFM constraints to achieve final package design closure.
  • Partner closely with silicon, system, and external vendor teams while developing simulation methodologies to boost modeling accuracy and efficiency.
We're looking for you if you have
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
  • 8 years of experience in SI/PI design for chip/package or system PCB.
  • Experience in industry SIPI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc.).
  • Experience with lab bring-up, test environments, and characterization for high-speed memory and SerDes.
  • Experience with partnering across chip architecture, physical design, static timing analysis (STA), package, and validation teams.
  • Experience in Python, MATLAB, or C++ to establish automated flows and data processing tools.
Bonus points
  • Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
  • Deep knowledge of SI/PI analysis for high-speed interconnects (HBMx, D2D/chiplets, PCIe, SerDes) and timing budget methodologies.
  • Direct experience with silicon interposers, silicon bridges, and 3D die stacking architectures.
What's in it for You

Reveal great tech solutions

Join the team of experts who create custom, cutting-edge tech solutions for world-renowned businesses, fueling clients growth. Unleash your potential, tackle new challenges, and be part of a team that values your skills and contributions. Focus on long-term impact and building tailored, long-lasting partnerships with our clients.

Experience an agile and flexible working environment

Work fully remote around the globe, or in a hybrid work model from our office hubs which are equipped with everything needed for comfortable work. Enjoy a flexible working schedule and create work and rest balance for yourself. Empower yourself with a stable workload and a stable income, focusing on lasting cooperation and high-performance culture.

Embrace the opportunity for personal and professional growth

Take advantage of performance review and career path. Elevate your skills with mentorship program, personal development plan, and individual learnings through the corporate library, public speaking support, and more.

Feel cared about

Be among like-minded people and feel supported with collaboration, open communication and mutual respect. Join company-wide tech and cultural events, and contribute to meaningful CSR initiatives that resonate with your values.

Interview steps
  • Interview with Recruiter
  • Manager Interview
  • Client Interview
  • Core Responsibilities

    Lead signal and power integrity analysis and optimization for high-performance computing designs using advanced packaging technologies, from early product definition through package design closure. Collaborate with chip, system, validation, and vendor teams to evaluate high-speed interfaces, develop memory interfaces, improve simulation methodologies, and support post-silicon validation and qualification.

    Requirements

    Candidates need a bachelor's degree in a relevant engineering or computer science field, or equivalent practical experience, and at least eight years of SI/PI design experience for chip/package or system PCB. They should have experience with SI/PI modeling tools, high-speed memory and SerDes lab characterization, cross-functional design and validation work, and automation using Python, MATLAB, or C++; advanced degrees and expertise in chiplet and 3D packaging are advantageous.

    Benefits

    • Flexible Working Schedule
    • Remote Work Option
    • Hybrid Work Option
    • Stable Workload
    • Stable Income
    • Mentorship Program
    • Personal Development Plan
    • Corporate Learning Resources
    • Public Speaking Support

    About SPD Technology

    Industry: IT Services and IT Consulting

    Company size: 501-1,000 employees

    SPD Technology is a global software product and AI-native development company with over 650 professionals and delivery centers across Europe. Since 2006, we've partnered closely with startups, SMBs, and blue-chip organizations including PitchBook, Morningstar, Blackhawk Network, Space Needle, and Axcess to turn ambitious ideas into software that holds up in the real world. AI is increasingly embedded in how we build, with engineers working alongside AI agents across the full lifecycle – from planning and architecture to code, testing, review, and release. Our verification-first approach treats AI-generated code as something to be proven, not simply trusted, helping teams accelerate delivery without compromising reliability, security, and maintainability. We apply AI-assisted or traditional engineering approaches based on what delivers the best results for each engagement. Whether you need to launch a new product, scale your engineering capacity, modernize your technology stack, or adopt AI across your product and engineering organization, SPD Technology brings the right expertise to get you there. With deep domain expertise in fintech, digital payments, LegalTech, eCommerce, logistics, education, and other industries, along with data- and AI-native engineering, ML/computer vision, and cloud capabilities, SPD Technology is an official AWS and Adyen partner and a Select Services Partner in Anthropic’s Claude Partner Network.

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