Key Skills
Job Description
About This Vacancy Are you an experienced Semiconductor Packaging Engineer looking to work on next-generation packaging technologies? We're seeking a Senior Process Engineer to join an innovative R&D environment focused on developing advanced die attach, assembly, and packaging solutions. In this role, you'll combine process development, package design, materials expertise, and hands-on experimentation to bring new technologies from concept to realization. What you'll do: - Develop and optimize advanced die attach and assembly processes - Design packages, packaging components, and manufacturing tooling - Drive thin die assembly development (≤50 µm) - Plan and execute DoE studies and analyze results - Program and operate advanced packaging equipment - Work closely with international customers and technology partners - Mentor junior engineers and students What We Expect From You 8+ years of experience in semiconductor packaging - Strong knowledge of assembly, die attach, and interconnection technologies - Experience with AutoCAD, SolidWorks, or similar CAD tools - Expertise in DoE, data analysis, and process development - Knowledge of Ag and Cu sintering is a strong plus - Hands-on, proactive, and customer-focused mindset What You Can Expect From Us TMC is an international high-tech consultancy company that brings expertise to its clients in order to support them with the realization of their technological challenges. As such, TMC is operating as an expert center at the disposition of its clients and we help them to be more competitive in an ever more global and faster-changing technological world. At TMC we believe that people are the driving force behind technological innovation. That is why we want to create the best possible conditions for tech talents to thrive in. We offer you a challenging and stimulating work environment in which you can be the director of your own career. As an Employeneur you are part of our TMC family. Next to our outstanding technical expertise, fun and engagement are meaningful parts of our culture.
Core Responsibilities
Develop and optimize advanced die attach and assembly processes while designing packaging components and manufacturing tooling. Drive thin die assembly development and execute DoE studies to bring new technologies from concept to realization.
Requirements
Requires 8+ years of experience in semiconductor packaging and strong knowledge of assembly and interconnection technologies. Proficiency in CAD tools like AutoCAD or SolidWorks and expertise in data analysis and process development are essential.
About TMC
Industry: Business Consulting and Services
Company size: 1,001-5,000 employees
TMC - The Member Company. If it’s people who drive technology, it makes sense that we provide you with the best driver’s seat available. You’re the driver. So fasten your seatbelt and be prepared to have your tech-mind driven to its limit. Entrepreneurial technologists with a crush on high tech and business push innovation and creative thinking. This idea is the basis of our dedication to create the perfect environment for technologists. A setting where you’re driven to discover, to evolve and to be challenged. A place where knowledge and know-how are shared to create combined brain power. At TMC you meet likeminded enthusiasts by working on exciting projects within specialized business cells. You find creative answers to existing issues by joining TechTanks and satisfy your high-tech hunger at pizza-sessions. You work on awesome machines and co-create solutions in our Entrepreneurial Lab for clients such as Philips, ASML and TNO. At the same time, we sharpen your technical and entrepreneurial drive by providing you with the perks of our unique philosophy; Employeneurship. Join TMC and drive your career to Employeneurship.