Photonic Packaging Engineer
Key Skills
Job Description
Are you passionate about the cutting-edge field of photonic integrated circuits? Do you thrive on solving complex challenges in electronic and photonic IC packaging? If so, we have an exciting opportunity for you! As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC packaging and assembly processes. Your role will involve leading customer projects, translating their unique requirements into precise assembly designs, and collaborating closely with our engineering team to optimize product designs for manufacturability. This position offers an opportunity to contribute to new advancements in photonic technologies and play a key role in the success of innovative projects.
Your primary responsibilities will include
Perform hands-on packaging and assembly of PIC based modules
Translate diverse customer requirements into detailed assembly design
Collaborate closely with design engineers to optimize product designs.
Innovate optical interconnection methods for seamless integration.
Design and refine assembly setups for effective validation and prototyping.
Implement automation techniques to enhance assembly efficiency and ensure scalability.
Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics or a related field.
Minimum of 3 years of professional experience in photonic or electronic packaging or testing.
Proficiency in applying Six Sigma in product development and process improvement
Experience with optical design software, such as Ansys Zemax, for simulating and optimizing optical systems.
Practical and pragmatic approach to problem-solving.
Ability to work independently with strong communication skills.
Excellent personal organization and proficiency in reporting and documentation.
What we offer you
A position in the emerging field of photonic IC packaging, offering numerous exciting challenges and opportunities for personal initiative and growth.
Being part of a young, dynamic and enthusiastic international team.
Benefits include paid time off (PTO), 401k match, health insurance.
Position is exempt from overtime.
Core Responsibilities
The Photonic Packaging Engineer will develop and refine innovative PIC packaging and assembly processes while leading customer projects. They will collaborate with design engineers to optimize product designs for manufacturability and implement automation techniques to enhance efficiency.
Requirements
Candidates must hold an MSc degree in photonics, physics, electrical engineering, or a related field. A minimum of 3 years of professional experience in photonic or electronic packaging is required, along with proficiency in Six Sigma and optical design software.
Benefits
- Paid time off
- 401k match
- Health insurance
About PHIX
Industry: Semiconductor Manufacturing
Company size: 51-200 employees
PHIX is a world leading packaging and assembly foundry for Photonic Integrated Circuits (PICs), building optoelectronic modules based on all major PIC technology platforms (such as Indium Phosphide, Silicon Photonics, Silicon Nitride, Planar Lightwave Circuit and others) in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC and MEMS assembly. #siliconphotonics #hightechindustry #microassembly #mems #optoelectronics #photonics #opticalfiber